JEM America offers a line of Vertical Probe Cards suitable
for a wide spectrum of probing applications. The biggest focus
in our R&D efforts is in the area of vertical contact
technology. Combining breakthroughs in interconnect technology
and precision manufacturing techniques, our vertical probe
cards can provide a number of performance benefits that are
unattainable in the conventional cantilever probe cards. We
are confident that our vertical probe cards are the reliable
and cost-effective probing solution for the next-generation
devices and the increasingly challenging test environment.
As our first vertical technology, VC-Series Probe Cards have
achieved a proven track record for multi-die memory probing and
wafer level burn-in as well as logic device probing. The
VS-Series Probes Cards are developed for area array and
solder/Cu bump probing applications. And the VE-Series are
for high parallelism testing of image sensor devices.
JEM's Vertical Probe Cards consist of four main components:
Probe, Guide Plate, Space Transformer, and PCB. If you are
interested in learning individual product’s structure
and specifications, please contact your JEM sales representative
or JEM America directly.