As JEM’s first vertical technology, the VC-Series Probe
Cards have achieved a proven track record for multi-die memory
probing, multi-die logic probing and wafer level burn-in.
They are suitable for testing high speed memory devices such
as RAMBUS and SDRAM.
The VC-Series Probe Card has some unique features that offer
major improvements over conventional cantilever probe cards.
First, ceramic guide plates allow planarity and alignment
to remain very stable over time and use, hence minimizing
the frequency of maintenance. Second, the scrub marks are
much smaller than those of cantilever probe cards, resulting
in less damaged pads for packaging. Also, the VC-Series card
provides uniform contact force for all pads of a die regardless
of layout and no. of probes. This is particularly useful for
matrix configurations. Another feature of VC-Series card is
that space transformer is not required. This allows not only
larger probing area, but also quicker lead time and lower
costs than other types of vertical technologies.
The latest VC4-Series is developed for large
probing area applications. It can support up to 12” full
wafer testing for NAND and 12” wafer burn-in for memory (NAND
and DDR). This is achieved by using block construction
(tile) for the probe head unit. The latest model, VC-430,
can accommodate probing area of 300mm in diameter.
Probing Area Allowed
# of Touchdowns
160mm x 160mm
4 Touchdowns on 12” wafer
200mm in diameter
1 Touchdown on 8” wafer
300mm in diameter
1 Touchdown on 12” wafer